Previous year question paper for ECM (Diploma Electronics & Communication Engineering 3rd)

  1. Home
  2. hptsb
  3. diploma
  4. ece
  5. 3rd
  6. ecm
Watch More

Electronic Components and Materials

Previous year question paper with solutions for Electronic Components and Materials from 2012 to 2012

Our website provides solved previous year question paper for Electronic Components and Materials from 2012 to 2012. Doing preparation from the previous year question paper helps you to get good marks in exams. From our ECM question paper bank, students can download solved previous year question paper. The solutions to these previous year question paper are very easy to understand.

1. Materials (32 hrs)

1.1Classification of materials: Conducting, semi-conducting and insulating

materials through a brief reference to their atomic structure.

1.2Conducting Materials: Resistivity and factors affecting resistivity.

Classification of conducting materials into low resistivity and high resistivity

materials.

1.3Insulating Materials:

- Electrical properties: Volume resistivity, surface resistance, dielectric loss,

dielectric strength (breakdown voltage) and dielectric constant.

-Thermal properties: Heat resistance, classification according to

temperature endurance, thermal conductivity.

- Brief introduction of the following materials and their applications. Mica,

Paper, Asbestos, Ceramic, Teflon, Acrylics, Silicon grease, Bakelite, Epoxy

Glass, Soldering Lead alloy.

1.4Magnetic Materials: Different Magnetic materials; (Dia, Para, Ferro) and

their properties. Ferro magnetism, Domains, permeability, Hysteresis loop.

Soft and hard, magnetic materials, their examples and typical applications.

1.5 Latest developments in Materials: Idea about latest materials in the light of

technological advancements like hybrid carbon, advanced ceramic , and

liquid crystals.

2. Components (32 hrs)

2.1 Capacitors:

a) Concept of capacitance and capacitors, units of capacitance, types of

capacitors, constructional details and testing specifications.

b) Capacity of parallel plate capacitors, spherical capacitors, cylindrical

capacitor.

c) Energy stored in a capacitor.

d) Concept of dielectric and its effects on capacitance, di-electric constant,

break down voltage. 

2.2Resistors: Carbon film, metal film, carbon composition, wound and variable

types (presets and potentiometers).

2.3Transformer, inductors and RF coils: Methods of manufacture, testing, Need

of shielding, application and trouble shooting.

2.4Surface Mounted Devices (SMDs): Constructional details and specifications.

2.5Connectors, Relays, switches and cables: Different types of connectors,

relays, switches and cables, their symbols, specifications, construction,

types, applications and their testing.

2.6 Semi Conductors and Integrated Circuits: Basic characteristics of

Semiconductor materials, diodes, transistors, FETs, and SCRs. Various

processes in IC manufacturing. Superconductivity and piezoelectric ceramic

transducer elements

Mark Favorite
2012
Download
Download
Related Subjects
CPA DE EDC NFTL PCE
Tags
ecm